TechConnect Ventures Spring Challenge: Simulation And Optimization Of Biscuit Cookie Trays

TechConnect Ventures Spring Challenge: Simulation And Optimization Of Biscuit Cookie Trays

05dec11:59 pmTechConnect Ventures Spring Challenge: Simulation And Optimization Of Biscuit Cookie TraysPartnership opportunity with Mondelez

Event Details

Mondelez, a Fortune 500 company, seeks partners who can optimize plastic trays used for product protection during transit. They seek expertise in simulation, design, and materials to reduce weight while maintaining safety and performance. Mondelez is open to collaboration with design firms, simulation platform providers, and organizations with AI/ML-supported capabilities. They are particularly interested in those who can transition from simulation to real-world product validation.

Does that sound like you?

Enter this sprint – open to participants from various industries, including automotive, aerospace, and logistics, who can contribute diverse perspectives. Mondelez will review submissions in December 2023, with direct engagement starting in January 2024. Join this initiative to drive innovation and shape the future of packaging while reducing environmental impact.

Learn more and submit challenge requirements by December 5th.

Time

(Tuesday) 11:59 pm(GMT-05:00)