TECDIA Launches Ultra-Fine kaikaFIN Nozzle for Mako Hotend in Partnership With Slice Engineering
Japanese precision machining company TECDIA Co., Ltd. has unveiled the kaikaFIN, a next-generation 3D printing nozzle designed for the Mako Hotend by UF Innovate | Accelerate client Slice Engineering. Released simultaneously in Japan and the United States, the kaikaFIN made its debut at RAPID + TCT 2025 in Detroit.
The kaikaFIN is engineered to support ultra-fine 0.1mm layer resolution printing, targeting professionals and advanced hobbyists using Bambu Lab systems. The nozzle is available in 0.1mm and 0.4mm variants, although only the former is currently offered in the U.S.
The company’s dispenser nozzles are widely used by smartphone manufacturers. It entered the additive manufacturing market with the “kaika” nozzle line, designed for high-resolution 3D printing across hobbyist and industrial applications.