Dalir Joins National Effort To Enable 3D Optical Packaging for Next-Gen AI Chips

UF researcher Hamed Dalir, PhD, is part of a nationally-funded initiative to develop a transformative three-dimensional optical packaging platform that redefines how data is routed across and between chips. The $5.2M project is led by Ali Adibi, PhD, professor in the Department of Electrical & Computer Engineering at Georgia Institute of Technology, in partnership with Dalir, Juejun Hu, PhD, associate professor in the Department of Materials Science & Engineering at the Massachusetts Institute of Technology, and colleagues at AIM Photonics, and nHanced Semiconductor. The team aims to unlock new levels of scalability, bandwidth, and energy efficiency by vertically stacking photonic layers and enabling seamless chip-to-chip optical communication.