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	<title>Juejun Hu &#8211; UF Innovate</title>
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	<title>Juejun Hu &#8211; UF Innovate</title>
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		<title>Dalir Joins National Effort To Enable 3D Optical Packaging for Next-Gen AI Chips</title>
		<link>https://innovate.research.ufl.edu/3d-optical-packaging-for-next-gen-ai-chips/</link>
		
		<dc:creator><![CDATA[sooyoungryu]]></dc:creator>
		<pubDate>Thu, 15 May 2025 00:00:00 +0000</pubDate>
				<category><![CDATA[News Brief]]></category>
		<category><![CDATA[Tech Licensing]]></category>
		<category><![CDATA[UF Innovate]]></category>
		<category><![CDATA[UF Inventors]]></category>
		<category><![CDATA[AI]]></category>
		<category><![CDATA[AI Chips]]></category>
		<category><![CDATA[Ali Adibi]]></category>
		<category><![CDATA[artificial intelligence]]></category>
		<category><![CDATA[Hamed Dalir]]></category>
		<category><![CDATA[Juejun Hu]]></category>
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					<description><![CDATA[UF researcher Hamed Dalir, Ph.D., is collaborating on a $5.2 million federally funded project to develop a transformative 3D optical packaging platform that enables scalable, high-bandwidth, energy-efficient chip-to-chip optical communication.]]></description>
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<p>UF researcher Hamed Dalir, PhD, is part of a nationally-funded initiative to develop a transformative three-dimensional optical packaging platform that redefines how data is routed across and between chips. The $5.2M project is led by <a href="https://sites.gatech.edu/ece-prg/people_old/adibi/" target="_blank" rel="noreferrer noopener">Ali Adibi, PhD</a>, professor in the Department of Electrical &amp; Computer Engineering at Georgia Institute of Technology, in partnership with Dalir, <a href="https://mrl.mit.edu/index.php/Faculty/Juejun_Hu" target="_blank" rel="noreferrer noopener">Juejun Hu, PhD</a>, associate professor in the Department of Materials Science &amp; Engineering at the Massachusetts Institute of Technology, and colleagues at AIM Photonics, and nHanced Semiconductor. The team aims to unlock new levels of scalability, bandwidth, and energy efficiency by vertically stacking photonic layers and enabling seamless chip-to-chip optical communication.</p>



Read more about <a href="https://news.ece.ufl.edu/2025/05/14/dalir-joins-national-effort/"> Dalir Joins National Effort To Enable 3D Optical Packaging for Next-Gen AI Chips.</a>
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